> Sales > A8A
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| The A8a test system provides the flexibility of flying probe testers while delivering high throughput testing for bare board printed circuit boards (PCBs). The target market for the A8a is the electrical test of tablet and PC motherboards and high density interconnect (HDI) products for smart phones. The A8a is designed for high productivity, reliability and test accuracy. To achieve high throughput the key feature of the A8a is a new dual shuttle system, which reduces the product exchange time to zero seconds in automation mode. In combination with the fast test speed of up to 140 measurements/second the A8a will give customers a competitive test solution for batches up to 5000 boards. A typical cycle time of a 4-up smart phone board is about 2 minutes. To ensure accuracy the A8a is equipped with eight test heads and four cameras for optical alignment. The A8a is able to test pad sizes down to 35 micron and is capable of testing HDI products for smart phones or tablet and PC motherboards up to a test area of 18.0” x 12.0”. The A8a eliminates limitations due to test point density or fine-pitch contacts and also features embedded component test or a 4-wire Kelvin measurement capability with an accuracy of +/- 0,025 mΩ. The exchangeable clamping and tension bars can handle thin boards, too. |
| Fully automated test system for medium batch sizes in lights-out operation.Basic unit with 8 test probes (4 top, 4 bottom) |
| Max. board size (X x Y) | 460 mm x 330 mm / 18.1” x 13.0” |
|---|---|
| Min. board size (X x Y) | 50 mm x 40 mm / 2.0” x 1.6” |
| Test area (X x Y) | 460 mm x 310 mm / 18.1” x 12.2” |
| Board thickness | up to 5 mm, max. 2 kg |
| Product exchange time | 0 s with dual shuttle mode,for test area max. 300 mm x 310 mm< 15 s with single shuttle mode |
| Loader capacity | 390 mm240 boards / 1.6 mm thickness |
| Smallest pad | 35 μm / 1.4 mil* (with micro probes and glass calibration) |
|---|---|
| Smallest pitch | 80 μm / 3.2 mil |
| Resolution measurement system | m ± 1 μm / ± 0.04 mil |
| Repeatable accuracy | ± 4 μm / ± 0.16 mil |
| Soft touch probes | 5 g to 10 g |
| *Micro needle probes | 0.3 g to 2.5 g |
| Continuity test | 1 Ω to 10 KΩ (2-wire) |
|---|---|
| Isolation test | up to 25 MΩ (FM), up to 10 GΩ (ohmic) MicroShort Detection® |
| Test voltage | 100 mV to 1000 V (ohmic) |
| 4 color cameras for fast optical scanning of top and bottom side.Resolution 9 μm/ pixel |
| 4-wire measurement with max. 300 mA test current | |
| 0.1 mΩ to 300 KΩ | ± 2 %, min. ± 0.025 mΩ |
|---|---|
| with Kelvin probes | 0.3 g to 2.5 g |
| Smallest pad | 60 μm / 2.4 mil* |
| Smallest pitch | 100 μm / 4.0 mil* |
| *with Kelvin probe fine adjustment | |
| Embedded components test | |
| R | 0.5 Ω to 10 MΩ ± 0.5 %, min. ± 0.5 Ω > 10 MΩ to 50 MΩ ± 2 % |
|---|---|
| C | 0.1 pF to 100 μF ± 2 %, min. ± 0.03 pF |
| L | 0.2 μH to 5 mH ± 3 %, min. ± 0.1 μH |
| Diode / Varistor | UF, UR, UBR, 100 mV to 12.5 V Structural test of integrated circuits: opens/shorts test on CMOS devices with ESD diodes |
| Multi-Point Measurements (only available with dual shuttle) |
Up to three AC/DC sources (voltage and current) simultaneously. Transistors (MOSFET and Bipolar), Optocouplers, Fuses, Relays, Transformers, etc. Imax = 300 mA |
| LaTest® open detection | |
| Layup table for optimized product exchange time in signle shuttle mode | |
| Label printer with barcode support | |
| Pen marker | |
| Retest of fault files from external grid test systems on inquiry | |
| Repair software with barcode support | |
| Tensioning modules for flexible board thickness 0,05 mm to 1.0 mm | |
| Required Utility | |
| Data Input Format | IPC-D-356A |
|---|---|
| Network Connection | Ethernet, TCP / IP |
| Power Supply | 3 x 400 V, 50 Hz (3 x 208 V, 60 Hz), 1500 VA |
| Compressed Air | 8 bar / 115 psi, filtered |
| Temperature | 18 °C to 27 °C |
| Relative Humidity | 40% to 60% |
| Machine Weight | 2100 kg |
